Ramberg-Osgood Parameters for 63–37 Sn-Pb Solder
- 1 June 1992
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 114 (2) , 234-238
- https://doi.org/10.1115/1.2906423
Abstract
As part of a fracture properties study, the Ramberg-Osgood parameters were evaluated for 63-37 Sn-Pb (tin-lead) solder. This work was a preliminary step in experimentally determining J-integral values via the Hutchinson-Rice-Rosengren (HRR) power law for hardening materials. Consideration was given to both engineering strain and true strain when plotting the curves. Results disclosed little effect of either engineering or true strain at linear stress levels. For a strain-hardening exponent of 1.0, a material constant of 0.9849 was determined.Keywords
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