The Thermal Grounding of Electrical Leads at Low Temperatures
- 1 November 1969
- journal article
- research article
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 40 (11) , 1502-1503
- https://doi.org/10.1063/1.1683842
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Heat transfer below 0.2°KPhysica, 1968
- Transfer of Heat Below 0.15°KReview of Scientific Instruments, 1961
- Thermal Conductivity of 70-30 Cupro-Nickel Alloy from 0.3° to 4.0°KReview of Scientific Instruments, 1960