A simple experimental technique for the measurement of the work of adhesion of microstructures
- 2 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
- Advances in processing techniques for silicon micromechanical devices with smooth surfacesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The effect of release-etch processing on surface microstructure stictionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Electrostatic parallelogram actuatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Control of residual stress of polysilicon thin films by heavy doping in surface micromachiningPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Theoretical modeling of boundary conditions in microfabricated beamsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Bonding of silicon wafers for silicon-on-insulatorJournal of Applied Physics, 1988
- Adhesion of Dust and PowderPublished by Springer Nature ,1982
- The adhesion and surface energy of elastic solidsJournal of Physics D: Applied Physics, 1971
- Double-Cantilever Cleavage Mode of Crack PropagationJournal of Applied Physics, 1964
- Direct Measurements of the Surface Energies of CrystalsJournal of Applied Physics, 1960