Three-dimensional finite element analysis of thin-film stresses using algor personal-computer-based software

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Abstract
Algor, a commercially available, personal computer-based, finite element software package was used to study three-dimensional stress–strain relations in both free standing and adherent thin films. The accuracy of the analyses was verified by comparison to tensile tests and analytical calculations of radius of curvature. The results also agree with earlier two-dimensional calculations. The program was used to simulate tensile testing in order to establish limits on film dimensions to yield Young’s modulus upon the application of a uniaxial stress approximation. Stress contours and deflections arising from submicroscopic elastic Poisson effects (necking) were determined for different film dimensions. In addition, the effect of using adhesives in sample mounting for tensile testing was studied, and the three dimensional models and results are compared to similar two-dimensional calculations.

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