X-ray lithography system development at IBM: overview and status

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Abstract
This paper describes the work conducted at IBM to study the feasibility of x-ray lithography for production of high-density silicon chips. The system approach to x-ray lighography adopted at IBM which considers the interaction of all the components is presented. In particular, the following areas are described in some detail: x-ray sources, masks, resists, exposure tools, prototype devices fabricated with x-ray lighography, and the resolution of x- ray lighography. In addition, the status of the Advanced Lithography Facility which house the compact electron storage ring x-ray source, procured by IBM from Oxford Instruments, is presented.

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