Methodology for the thermal characterization of the MQUAD microelectronic package

Publisher Website

30 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/stherm.1993.225316

Abstract

No abstract available

This publication has 1 reference indexed in Scilit:

Thermal analysis of plastic QFP with high thermal dissipation
Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003