Bayesian surrogates for integrating numerical, analytical, and experimental data: application to inverse heat transfer in wearable computers
- 1 March 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 23 (1) , 23-32
- https://doi.org/10.1109/6144.833038
Abstract
No abstract availableKeywords
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