Electrical CAD Analysis for Multilayer Package Design
- 1 March 1987
- journal article
- Published by Emerald Publishing in Microelectronics International
- Vol. 4 (3) , 38-41
- https://doi.org/10.1108/eb044291
Abstract
One of the most challenging problems facing the package designer today is how to predict electrical performance before committing a design to fabrication. One means of accomplishing this task is to employ computer‐aided design (CAD) tools that analyse performance from simulations done on models derived from the physical package structures. These models, when combined with the chip models, allow interactive simulation and timing analysis of an entire multilayer package. This paper describes a CAD approach for evaluating interconnect performance within multilayer package structures and presents several examples to show how the approach is applied.Keywords
This publication has 1 reference indexed in Scilit:
- Shielded Coupled-Strip Transmission LineIEEE Transactions on Microwave Theory and Techniques, 1955