Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation
- 10 November 2004
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 43 (11A) , 7427-7433
- https://doi.org/10.1143/jjap.43.7427
Abstract
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