Permanent magnet electron cyclotron resonance plasma source with remote window

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Abstract
An electron cyclotron resonance (ECR) plasma has been used in conjunction with a solid metal sputter target for Cu deposition over 200 mm diameters. The goal is to develop a deposition system and process suitable for filling submicron, high-aspect ratio ULSI features. The system uses a permanent magnet for creation of the magnetic field necessary for ECR, and is significantly more compact than systems equipped with electromagnets. A custom launcher design allows remote microwave injection with the microwave entrance window shielded from the copper flux. When microwaves are introduced at an angle with respect to the plasma, high electron densities can be produced with a plasma frequency significantly greater than the electron cyclotron frequency. Copper deposition rates of 1000 Å/min have been achieved.

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