Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication
- 27 May 2003
- journal article
- Published by Elsevier in Chemical Engineering Journal
- Vol. 95 (1-3) , 205-211
- https://doi.org/10.1016/s1385-8947(03)00106-2
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Correlation between organic component and electrode material: consequences on removal of surfactants from wastewaterElectrochimica Acta, 2000
- Treatment of landfill leachate by combined electro-Fenton oxidation and sequencing batch reactor methodWater Research, 2000
- The influence of residence time on the anodic oxidation of phenolSeparation and Purification Technology, 2000
- Treatment of Alumina and Silica Chemical Mechanical Polishing Waste by Electrodecantation and ElectrocoagulationJournal of the Electrochemical Society, 1999
- Saline wastewater treatment by electrochemical methodWater Research, 1998
- Defluoridation of septentrional Sahara water of north Africa by electrocoagulation process using bipolar aluminium electrodesWater Research, 1998
- Treatment of textile wastewater by chemical methods for reuseWater Research, 1997
- Electrochemical removal of nitrite and ammonia for aquacultureWater Research, 1996
- Continuous treatment of textile wastewater by combined coagulation, electrochemical oxidation and activated sludgeWater Research, 1996
- Electrocoagulation of potable waterWater Research, 1984