Three-dimensional photoelastic analysis in axially loaded thick plate with hole
- 1 July 1973
- journal article
- Published by SAGE Publications in Journal of Strain Analysis
- Vol. 8 (3) , 220-227
- https://doi.org/10.1243/03093247v083220
Abstract
In this study three-dimensional photoelasticity is used to analyse the stress variation through different layers of a thick plate containing a circular hole and subjected to uniform tensile loading. The effect of the thickness/diameter ratios on the stress concentrations with thickness is investigated. The experimental results are correlated with the existing three-dimensional theoretical solutions. The data establish, both experimentally and theoretically, the precise location of the maximum-stress layers in plates having different thickness/diameter ratios and thus resolves the discrepancies which existed in previous studies.Keywords
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