Laser induced copper plating
- 1 June 1983
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 54 (6) , 3629-3631
- https://doi.org/10.1063/1.332404
Abstract
Argon laser induced plating of copper spots and lines from copper sulfate solutions on glass and phenolic resin paper has been investigated. The substrates had to be precoated with an evaporated copper film. The highest plating rates have been obtained with a small film thickness of 25 nm. Spots with a thickness up to 30 μm were plated.This publication has 3 references indexed in Scilit:
- Laser-Enhanced Plating and Etching: Mechanisms and ApplicationsIBM Journal of Research and Development, 1982
- Investigation of Laser‐Enhanced Electroplating MechanismsJournal of the Electrochemical Society, 1981
- Laser enhanced electroplating and maskless pattern generationApplied Physics Letters, 1979