Integrated injection logic with extended temperature range capability

• 1 January 1979
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 192-195
• https://doi.org/10.1109/iedm.1979.189576

Abstract

Keywords

• TEMPERATURE DISTRIBUTION
• SILICON
• LEAKAGE CURRENT
• CONDUCTIVITY
• LOGIC DEVICES
• SEMICONDUCTOR PROCESS MODELING
• SEMICONDUCTOR DEVICE DOPING
• CIRCUITS
• LABORATORIES
• IMMUNITY TESTING