Projection photolithography-liftoff techniques for production of 0.2-µm metal patterns
- 1 November 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 28 (11) , 1375-1378
- https://doi.org/10.1109/T-ED.1981.20616
Abstract
A technique which allows the use of projection photolithography with the photoresist liftoff process, for fabrication of Submicrometer metal patterns, is described. Through-the-substrate (back-projection) exposure of the photoresist produces the undercut profiles necessary for liftoff processing. Metal lines and superconducting microbridges of 0.2-µm width have been fabricated with this technique. Experimental details and process limits are discussed.Keywords
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