Characterization of plated via hole fences for isolation between stripline circuits in LTCC packages
- 27 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 3, 1831-1834
- https://doi.org/10.1109/mwsym.1998.700838
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Characterization of high frequency interconnects using finite difference time domain and finite element methodsIEEE Transactions on Microwave Theory and Techniques, 1994