Evaluation of Electrically Insulative Adhesives for Use in Hybrid Microcircuit Fabrication
- 1 December 1973
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 9 (4) , 199-207
- https://doi.org/10.1109/tphp.1973.1136737
Abstract
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