A finite element model of persistent slip band interaction with strengthened surface films during low cycle fatigue
- 31 December 1990
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 130 (2) , 127-138
- https://doi.org/10.1016/0921-5093(90)90054-7
Abstract
No abstract availableThis publication has 30 references indexed in Scilit:
- Quantitative measurement of persistent slip band profiles and crack initiationActa Metallurgica, 1986
- Low amplitude fatigue of copper single crystals—II. Surface observationsActa Metallurgica, 1985
- The improvement of fatigue life in Ti-6Al-4V by ion implantationJournal of Applied Physics, 1982
- Dislocation behavior in fatigue VI: Variation in the localization of strain in persistent slip bandsMaterials Science and Engineering, 1981
- The effect of ion implantation on the fatigue properties of polycrystalline copperNuclear Instruments and Methods, 1981
- Fatigue-life enhancement by ion implantationScripta Metallurgica, 1978
- The effect of ion plating on the low cycle fatigue behavior of copper single crystalsMaterials Science and Engineering, 1976
- Strain localization in cyclic deformation of copper single crystalsPhilosophical Magazine, 1975
- A model for the fatigue of copper at low plastic strain amplitudesPhilosophical Magazine, 1974
- Random Slip Model of Fatigue and Coffin's LawNature, 1960