Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints
- 15 June 2000
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 285 (1-2) , 25-34
- https://doi.org/10.1016/s0921-5093(00)00661-4
Abstract
No abstract availableKeywords
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