The Role of the TiN Liner in Forcefill

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Abstract
Forcefill is a process by which aluminum from a blanket film, covering a via hole, is driven into the via hole at elevated pressure and temperature. The result of the forcefill process depends on the via wall material. A thin layer of is applied to the wall and the bottom of the via prior to aluminum deposition. This layer is referred to as the wetting layer or liner. Via holes with a liner are filled by the forcefill process, whereas vias without a liner are not filled at all. The dependence of the filling on the presence of a liner is explained by the provision of a path for stress driven diffusion of aluminum atoms onto the via wall. ©1998 The Electrochemical Society

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