Quantitative analysis of arsenic-implanted layers in silicon by synchrotron-radiation-excited x-ray fluorescence

Abstract
The quantitative analysis of arsenic-implanted silicon using the novel technique of synchrotron radiation x-ray fluorescence (SRXF) is reported. An extension of x-ray fluorescence (XRF) theoretical correction factors to the Gaussian impurity distribution is also presented. In the sample analyzed, the dose of arsenic implant is found to be 2.3×1015 atoms cm−2±0.5×1015 atoms cm−2, in reasonable agreement with the value of 1.0±0.1×1015 atoms cm−2 quoted by the implanters. The method is applicable to the rapid and nondestructive assessment of dose accuracy, uniformity, and reproducibility of a variety of ion-implanted species in various substrates.

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