Edge Viewing Photodetectors for Strictly In-plane Lightwave Circuit Integration and Flexible Optical Interconnects

This publication has 10 references indexed in Scilit:

• High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)
  Published by SPIE-Intl Soc Optical Eng ,2005
• Compact packaging of optical and electronic components for on-board optical interconnects
  IEEE Transactions on Advanced Packaging, 2005
• Estimation of lifetime distributions on 1550-nm DFB laser diodes using Monte-Carlo statistic computations
  Published by SPIE-Intl Soc Optical Eng ,2004
• Chip-to-Chip Optoelectronics SOP on Organic Boards or Packages
  IEEE Transactions on Advanced Packaging, 2004
• Flexible optical waveguide film with 45-degree micromirror couplers for hybrid E/O integration or parallel optical interconnection
  Published by SPIE-Intl Soc Optical Eng ,2004
• SMT-compatible large-tolerance "OptoBump" interface for interchip optical interconnections
  IEEE Transactions on Advanced Packaging, 2003
• Optical interconnections for parallel and distributed computing
  Proceedings of the IEEE, 2000
• New technology for electrical/optical systems on module and board level: the EOCB approach
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2000
• Polymeric optical waveguide films for short-distance optical interconnects
  IEEE Journal of Selected Topics in Quantum Electronics, 1999
• Limit to the Bit-Rate Capacity of Electrical Interconnects from the Aspect Ratio of the System Architecture
  Journal of Parallel and Distributed Computing, 1997