Development of a Novel No‐clean Solder Paste

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Abstract
The electronics industry faces a serious challenge in its approach to the cleaning of printed circuit boards after reflow soldering. A unique approach has been adopted to give invariant viscosity, hot/wet slump resistance and low residue solder pastes. Carefully tailored activation systems provide effective reflow and benign no‐clean residues. High metal loadings are incorporated with fine pitch capability and consistency of product.

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