Metal Membranes with Uniform Submicron-Size Pores

Abstract
Porous metal wafers and thin films were produced by selectively etching the rod phase of the directionally solidified eutectics NiAl–Cr and NiAl–Mo and by a two-state replication process, respectively. The 0.5-μ-diam holes were uniform in size and distribution with densities as high as 8.5×107 holes/cm2. The flow properties of these porous membranes were tested using three liquids of different viscosity and were found to be in agreement with Poisseuille's law.

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