Electrodeposition of Copper‐Nickel Alloys from Citrate Solutions on a Rotating Disk Electrode: II . Mathematical Modeling

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Abstract
A mathematical model is developed to simulate the electrodeposition of Cu‐Ni alloy from citrate solutions onto a rotating disk electrode under potentiostatic control. The model includes the influence of diffusion, ionic migration, forced convection, and homogeneous equilibria. The three major electrochemical reactions treated in the model are copper deposition, nickel deposition, and hydrogen evolution. Using experimental parameters when available, the model was fitted and tested against experimentally‐obtained results for different bath compositions and operating conditions. The model agreed reasonably well with the experimental results particularly in the codeposition region, −1.0 to −1.2V vs. SCE, where hydrogen evolution is not the major reaction. Also, the model's predictive capabilities are evaluated.

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