Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components (PEDs)
- 1 January 1977
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 16 (3) , 233-244
- https://doi.org/10.1016/0026-2714(77)90880-0
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Effect of certain hostile environments on adhesive jointsJournal of Chemical Technology & Biotechnology, 1967