A diffusional model for transient liquid phase bonding
- 1 February 1997
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 45 (2) , 701-707
- https://doi.org/10.1016/s1359-6454(96)00188-7
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich jointMetallurgical Transactions A, 1988
- Interdiffusion and phase formation in Au/Sn thin film couples with special emphasis on substrate temperature during condensationThin Solid Films, 1982
- Interdiffusion and phase formation at room temperature in evaporated gold-tin filmsThin Solid Films, 1977