Anodic Behavior in Cyanide Copper Plating Baths

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Abstract
The polarization of copper and copper‐iron anodes has been studied in cyanide copper plating baths under conditions which involved changes in the pH and in concentration of copper cyanide, sodium cyanide, Rochelle salts, and soda ash. The frequent occurrence of two critical points in the plots of anodic polarization vs. current density is interpreted as being associated with the cuprous and cupric reactions which result in anode corrosion. The displacement of these reactions with regard to current density by the various constituents of the plating bath is discussed.

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