Conductive Adhesives: A Critical Review of Progress to Date

Publisher Website
Google Scholar
Abstract
Conductive adhesives (CAs) have been with us for a number of years and have found use in a variety of applications. More recently pressure from environmentalists has led to a reappraisal of the potential of the materials to replace solders in mainstream assembly operations. In this respect they have the advantages that they do not contain lead and do not use fluxes. At present, however, there is no substitute for flow soldering operations which still account for a substantial part of the assembly market. There also appear to be serious grounds for concern regarding the reliability of adhesive joints. In particular, recent reports suggest that their resistance to mechanical shock may be unsatisfactory. In the light of these drawbacks it seems likely that CAs will continue to find niche applications, where their particular properties give them advantages, but that soldering will continue to be the dominant technology for PCB assembly for the foreseeable future.

This publication has 2 references indexed in Scilit: