Solute-dislocation interaction in copper-antimony solid solutions

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Abstract
The strain-hardening of solid solutions of antimony in copper at various concentrations has been studied at several temperatures. The flow stresses of the alloys can be separated into components representing (i) the hardening processes which occur in pure copper, and (ii) an ‘impedance’ term of the form I. (1 + ε), where ε = tensile strain and I ∞ (antimony concentration)1/2. I has the correct magnitude and dependences on temperature and concentration for a mechanism based on the ‘stress-activated’ breakaway of dislocations pinned by dispersed solute atoms. The temperature-dependence of I is shown to be responsible for the marked increase in lower yield stress at low temperatures. The dependence of the impedance on strain may arise because of the trapping of point defects by solute atoms.

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