Optimum design and selection of heat sinks
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (4) , 812-817
- https://doi.org/10.1109/95.477468
Abstract
No abstract availableKeywords
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- Optimal structure for microgrooved cooling fin for high-power LSI devicesElectronics Letters, 1986