Thermal Transport Across Superconducting Solder Joints Near 0.1°K
- 1 July 1967
- journal article
- research article
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 38 (7) , 964-966
- https://doi.org/10.1063/1.1720936
Abstract
Heat transfer rates across various types of soft solder joints are investigated between 0.06 and 0.5°K using a 3He−4He dilution refrigerator. For Cd‐Bi junctions and thin (10 μ) Sn‐Pb junctions, the heat flux per unit area and unit temperature difference is 4.7×106 T2.74 erg/sec. This rate is about twice that predicted by the theory of Little. Junctions of Sn‐Pb and Sn‐In about 40 μ thick have a much lower conductance. The thermal conductivity of bulk Sn‐Pb solder is found to be 9900 T2.31 erg/sec‐cm‐°K.Keywords
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