Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples
- 1 October 1997
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 238 (1) , 196-201
- https://doi.org/10.1016/s0921-5093(97)00449-8
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Growth kinetics of compound layers at the nickel-bismuth interfaceJournal of Alloys and Compounds, 1996
- The growth of Cu-Sn intermetallics at a pretinned copper-solder interfaceMetallurgical Transactions A, 1992
- Analysis of low-temperature intermetallic growth in copper-tin diffusion couplesMetallurgical Transactions A, 1992
- Kinetics of interfacial reaction in bimetallic CuSn thin filmsActa Metallurgica, 1982
- The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead AlloysTransactions of the IMF, 1976
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- On the Growth of an Alloy Layer between Solid Copper and Liquid TinJournal of the Japan Institute of Metals and Materials, 1970
- On the Dissolution of Copper in Liquid TinJournal of the Japan Institute of Metals and Materials, 1967