Investigations of failure mechanisms of TAB-bonded chips during thermal aging

Publisher Website

1 January 1990

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Vol. 13 (4) , 856-864
https://doi.org/10.1109/33.62530

Abstract

No abstract available

Keywords

This publication has 6 references indexed in Scilit:

Bond Strengths of Inner and Outer Leads on TAB Devices
Microelectronics International, 1986
The failure of aged CuAu thin films by Kirkendall porosity
Thin Solid Films, 1979
Diffusion-related behaviour of gold in thin film systems
Gold Bulletin, 1979
Interdiffusion in the CuAu thin film system at 25°C to 250°C
Thin Solid Films, 1977
Low-temperature diffusion of copper through gold
Journal of Applied Physics, 1976
On the porosity observed in the Kirkendall effect
Acta Metallurgica, 1953