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Numerical simulation of electromigration-induced shape changes of voids in bamboo lines
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Publications
Numerical simulation of electromigration-induced shape changes of voids in bamboo lines
Numerical simulation of electromigration-induced shape changes of voids in bamboo lines
O. Kraft
O. Kraft
E. Arzt
E. Arzt
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17 April 1995
journal article
Published by
AIP Publishing
in
Applied Physics Letters
Vol. 66
(16)
,
2063-2065
https://doi.org/10.1063/1.113903
Abstract
No abstract available
Keywords
GRAIN BOUNDARY
ELECTROMIGRATION
NUMERICAL ANALYSIS
NUMERICAL SIMULATION
INTEGRATED CIRCUIT
SURFACE DIFFUSION
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Cited by 68 articles
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