Quantitative high-resolution transmission electron microscopy of the incoherent Σ3 (211) boundary in Cu

This publication has 9 references indexed in Scilit:

• The influence of grain boundary inclination on the structure and energy of σ = 3 grain boundaries in copper
  Philosophical Magazine A, 1992
• Theoretical prediction and direct observation of the 9Rstructure in Ag
  Physical Review Letters, 1992
• Chemical lattice imaging: a pedantic note
  Ultramicroscopy, 1992
• Transmission electron microscope investigations of the structure of copper precipitates in thermally-aged Fe—Cu and Fe—Cu—Ni
  Philosophical Magazine Letters, 1991
• Semiconductor interfaces: Abruptness, smoothness, and optical properties
  Journal of Crystal Growth, 1989
• EMS - a software package for electron diffraction analysis and HREM image simulation in materials science
  Ultramicroscopy, 1987
• Embedded-atom method: Derivation and application to impurities, surfaces, and other defects in metals
  Physical Review B, 1984
• Calculation, display and comparison of electron microscope images modelled and observed
  Ultramicroscopy, 1982
• The influence of alloying, temperature, and related effects on the stacking fault energy
  Metallurgical Transactions, 1970