Application of Reflection Coefficient Dip to Layer Thickness Measurement by Acoustic Microscope

Abstract
A new method of layer thickness measurement appropriate for the electroplating process is proposed using a reflection acoustic microscope. This method is an application of the phenomenon that a reflection coefficient takes a dip-like minimum as a function of wave frequency, layer thickness and incident angle. The dip-like minimum is understood due to the excitation of pseudo Sezawa mode by investigating the dispersion relation of a surface acoustic wave.

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