Copper/Solder intermetallic growth studies

1 August 1993

journal article
research article
Published by Wiley in Microscopy Research and Technique

Vol. 25 (5-6) , 503-508
https://doi.org/10.1002/jemt.1070250522

Abstract

Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for ∼ 2.5 h at 170°C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffusion process and compare the observations to static SEM images reported to represent long-term, naturally aged intermetallic growth. The video obtained allows the observation of the diffusion process and relativistic growth phenomena at the Cu, Cu₃Sn, Cu₆Sn₅, and solder interfaces as well as effects on the bulk Cu and solder. Effects contrary to earlier reports were observed; for example, growth rates of Cu₃Sn were found to greatly exceed those of Cu₆Sn₅.

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