The past, present, and future of multilayer ceramic multichip modules in electronic packaging

• 1 July 1992
• journal article
• multichip module-packaging
• Published by Springer Nature in JOM
• Vol. 44  (7) , 10-14
• https://doi.org/10.1007/bf03222269

Abstract

Keywords

• CORDIERITE
• MOLYBDENUM POWDER
• MULTICHIP MODULE
• MULTILAYER SUBSTRATE
• MULTILAYER CERAMIC