Tin-silver-copper eutectic temperature and composition
- 1 April 2000
- journal article
- Published by Springer Nature in Metallurgical and Materials Transactions A
- Vol. 31 (4) , 1155-1162
- https://doi.org/10.1007/s11661-000-0111-5
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- New Pb-free solder alloy with superior mechanical propertiesApplied Physics Letters, 1993