A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods

1 December 1989

journal article
Published by ASME International in Journal of Electronic Packaging

Vol. 111 (4) , 313-320
https://doi.org/10.1115/1.3226554

Abstract

The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to obtain the correct thermal stresses is recommended.

Keywords

ELECTRONIC PACKAGING
THERMAL STRESSES
FINITE ELEMENT METHODS
ERRORS
COMPOSITE MATERIALS

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