The effect of pulsed reverse current on the polarization behaviour of acid copper plating solutions containing organic additives
- 1 March 1990
- journal article
- Published by Springer Nature in Journal of Applied Electrochemistry
- Vol. 20 (2) , 196-208
- https://doi.org/10.1007/bf01033595
Abstract
No abstract availableKeywords
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- The levelling mechanism during bright acid copper platingSurface Technology, 1982
- Adsorption of substances acting as brighteners in the electrolytic deposition of copperSurface Technology, 1978
- Radiotracer Study of Addition Agent Behaviour: 4—Mechanism of IncorporationTransactions of the IMF, 1964