Assembly process and solder joint integrity of the metal ball grid array (MBGA/sup TM/) package
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1265-1270
- https://doi.org/10.1109/ectc.1996.550897
Abstract
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- Thermal and electrical characterization of the metal ball grid array (MBGA)Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002