Evolution of surface relief during firing of PZT thin films
- 1 February 1994
- journal article
- research article
- Published by Taylor & Francis in Ferroelectrics
- Vol. 152 (1) , 67-72
- https://doi.org/10.1080/00150199408017598
Abstract
A controlled test of platinum bottom electrode preparation has been performed. Different types of Ti or TiOx layers have been used to promote adhesion of the platinum electrode. This paper correlates the surface roughness of these electrodes with electrical properties that result.Keywords
This publication has 2 references indexed in Scilit:
- Rapid isothermal processing of Pt/Ti contacts to p-type III-V binary and related ternary materialsIEEE Transactions on Electron Devices, 1992
- Diffusion in Thin Film Ti–Au, Ti–Pd, and Ti–Pt CouplesJournal of Vacuum Science and Technology, 1972