Hillock-free aluminum thin films for electronic devices
- 1 March 1971
- journal article
- 1970 electronic-materials-conference
- Published by Springer Nature in Metallurgical Transactions
- Vol. 2 (3) , 691-697
- https://doi.org/10.1007/bf02662723
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Solute induced grain boundary hardening in aluminumScripta Metallurgica, 1970
- Thermal Cycling and Surface Reconstruction in Aluminum Thin FilmsJournal of the Electrochemical Society, 1969
- Diffusion of Copper in Nickel and AluminumJournal of Applied Physics, 1965
- Effects of Third Elements on the Initial Aging of Al-10 wt%Zn AlloysJournal of the Japan Institute of Metals and Materials, 1965
- A resistometric study on the role of quenched-in vacancies in ageing of Al-Cu alloysActa Metallurgica, 1962
- Diffusion of Al26 and Mn54 in AluminumJournal of Applied Physics, 1962
- Interaction of vacancies with Sn atoms and the rate of G-P zone formation in an AlCuSn alloyActa Metallurgica, 1961