Application of the in situ TEM deformation technique to observe how “clean” and doped grain boundaries respond to local stress concentrations
- 31 March 1992
- journal article
- Published by Elsevier in Ultramicroscopy
- Vol. 40 (3) , 330-338
- https://doi.org/10.1016/0304-3991(92)90130-c
Abstract
No abstract availableThis publication has 34 references indexed in Scilit:
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