Influence on Thermal Fatigue Reliability of Pb-Free Solder Joint by Lead in Sn-Pb Plating.

Publisher Website

1 January 2001

journal article
Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging

Vol. 4 (1) , 41-46
https://doi.org/10.5104/jiep.4.41

Abstract

No abstract available

Keywords

This publication has 0 references indexed in Scilit: