Comparison of advanced plasma sources for etching applications. V. Polysilicon etching rate, uniformity, profile control, and bulk plasma properties in a helical resonator plasma source
- 1 July 1996
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 14 (4) , 2510-2518
- https://doi.org/10.1116/1.588761
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: