Soldering external connections to thin film systems

• 1 February 1981
• journal article
• research article
• Published by Wiley in Surface and Interface Analysis
• Vol. 3  (1) , 16-22
• https://doi.org/10.1002/sia.740030108

Abstract

Keywords

• SOLDER
• INTERMETALLICS
• TREATMENT
• BONDING
• DISSOLUTION
• FORMATION
• THIN
• FILM
• RELIABLE
• SYSTEMS