Trend of BGACSPKGD. Board Assembly Technology and Reliability of D2BGA CSP.

• 1 January 1998
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 1  (5) , 381-386
• https://doi.org/10.5104/jiep.1.381

Abstract

Keywords

• D2BGA CSP
• TECHNOLOGY AND RELIABILITY
• BGACSPKGD
• BOARD ASSEMBLY TECHNOLOGY
• RELIABILITY OF D2BGA